# EPSCoR Research Fellows: NSF: Wafer-Scale Fabrication and Packaging of Magnetic Planar Inductors on Silicon Carbide for Extreme- Environment Microelectronics

**Budget Signal Score:** 25/100

| Field | Value |
|---|---|
| Institution | Boise State University |
| Location | BOISE, ID |
| Project | EPSCoR Research Fellows: NSF: Wafer-Scale Fabrication and Packaging of Magnetic Planar Inductors on Silicon Carbide for Extreme- Environment Microelectronics |
| Award amount | $282,012 |
| Obligated so far | $282,012 |
| Awarded | 2026-08-11 |
| Period | 2027-01-15 to 2028-12-31 |
| Program | EPSCoR RII: EPSCoR Research Fe |
| Directorate / division | O/D / OIA |
| Award ID | 2624348 |

## Why this score
- Award of $282,012.

Source: U.S. National Science Foundation Awards API (https://www.nsf.gov/awardsearch/showAward?AWD_ID=2624348). Last refreshed: 2026-11-03T18:10:42.804Z.
Award data comes from the NSF Awards API and may be amended by NSF. Institution-level only; investigator contact details are not included. Informational only.