# Multi-Layer Optical Interconnects and Thermal Management for High-Density Chiplet-Based 3D Heterogeneous Integration

**Budget Signal Score:** 55/100

| Field | Value |
|---|---|
| Institution | Michigan State University |
| Location | EAST LANSING, MI |
| Project | Multi-Layer Optical Interconnects and Thermal Management for High-Density Chiplet-Based 3D Heterogeneous Integration |
| Award amount | $379,822 |
| Obligated so far | $379,822 |
| Awarded | 2026-07-15 |
| Period | 2026-10-01 to 2029-09-30 |
| Program | CSCS: Circuits and Systems for |
| Directorate / division | ENG / ECCS |
| Award ID | 2611297 |

## Why this score
- Award of $300K or more.
- Equipment- and compute-heavy field.

Source: U.S. National Science Foundation Awards API (https://www.nsf.gov/awardsearch/showAward?AWD_ID=2611297). Last refreshed: 2026-11-03T18:10:42.804Z.
Award data comes from the NSF Awards API and may be amended by NSF. Institution-level only; investigator contact details are not included. Informational only.